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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6450 Issued Date : 1992.11.25 Revised Date : 2002.04.18 Page No. : 1/3 HM28S NPN EPITAXIAL PLANAR TRANSISTOR Description The HM28S is a NPN silicon transistor, designed for use in general-purpose SPEECH SYNTHSIZER (Voice Rom) IC audio output driver stage amplifier applications. Features * Excellent hFE Linearity * High DC Current Gain * High Power Dissipation TO-92 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 C Junction Temperature .................................................................................................. 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C)............................................................................................. 850 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage..................................................................................................... 40 V VCEO Collector to Emitter Voltage ................................................................................................. 20 V VEBO Emitter to Base Voltage.......................................................................................................... 6 V IC Collector Current ..................................................................................................................... 1.25 A IB Base Current ............................................................................................................................. 0.4 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE1 *hFE2 hFE3 hFE4 fT Cob Min. 40 20 6 290 300 300 300 100 Typ. 9 Max. 100 100 0.55 1000 Unit V V V nA nA V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=100uA, IC=0 VCB=35V, IE=0 VEB=6V, IC=0 IC=600mA, IB=20mA VCE=1V, IC=1mA VCE=1V, IC=0.1A VCE=1V, IC=0.3A VCE=1V, IC=0.5A VCE=10V, IC=50mA, f=1MHz VCB=10V, f=1MHz, IE=0 *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF Classification of hFE2 Rank Range HM28S B 300-550 C 500-700 D 650-1000 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 VCE(sat) @ IC=30IB Spec. No. : HE6450 Issued Date : 1992.11.25 Revised Date : 2002.04.18 Page No. : 2/3 Saturation Voltage & Collector Current 75 C 25 C hFE @ VCE=1V o o Saturation Voltage (mV) 125 C o hFE 100 75 C 25 C 125 C o o o 100 0.1 1 10 100 1000 10 0.1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Capacitance & Reverse-Biased Voltage 100 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz).. . fT 100 Capacitance (pF) 10 Cob 10 1 0.1 1 10 100 1000 1 1 10 100 1000 Reverse Biased Voltage (V) Collector Current (mA) -VCE=10V Safe Operating Area 10000 900 800 Power Derating Collector Current-IC (mA) 1000 PT=1ms PT=100ms 100 PT=1s Power Dissipation-PD(mW) 700 600 500 400 300 200 100 10 1 1 10 100 0 0 50 100 o 150 200 Forward Biased Voltage-VCE (V) Ambient Temperature-Ta ( C) HM28S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6450 Issued Date : 1992.11.25 Revised Date : 2002.04.18 Page No. : 3/3 2 Marking: H 28S M Control Code 3 C Style: Pin 1.Emitter 2.Collector 3.Base D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HM28S HSMC Product Specification |
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